design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fixed inductors (chip inductors) & 1 - 2 + 3 1 4 ' 5 6 / 7 8 % 9 ' 10 f 11 pf pe 1005 (0402) 1608 (0603) 2.2 nh 10 nh 2n2 10n 0.3 nh 5 % 10 % d j k taping chip inductors product code shape size : mm (inch) inductance inductance tolerance packaging design no. chip inductors high power type type: eljpf eljpe features ? low dcr and large current capability, suitable for power circuitry. ? high frequency capability due to its non magnetic core. ? capable of being re-? ow or ? ow soldered. ? unique ceramic core / laser-cut technology. ? non polarity product. ? good for mounting. ? rohs compliant recommended applications ? wireless communication equipment and vari ous types of general electronic equipment. explanation of part numbers storage conditions ? package : normal temperature (C5 to 35 c), normal humidity (85 %rh max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew. ? operating temperature : C40 to +85 c storage period ? solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. even if storage conditions are wi thin speci? ed limits, solderability may be reduced with the passage of time. therefore, please control the storage condit ions and try to use the product within 6 months of receipt. packaging methods, soldering conditions and safety precautions please see data files. nov. 2013 04 1 2
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fixed inductors (chip inductors) 0.20.1 0.20.1 1.00.05 0.50.05 0.50.05 0.5 to 0.6 1.5 to 1.7 0.5 to 0.6 0.8 to 0.9 2.0 to 2.6 0.8 to 1.0 1.6 0.8 0.8 0.3 0.3 part no. inductance q srf ? 1 (mhz) min. r dc ? 2 ( ) max. dc current (ma) max. (nh) tolerance (%) test freq. (m hz) min. test freq. (m hz) eljpf2n2dfb 2.2 d : 0.3 nh 100 7 100 5300 0.040 1900 eljpf2n7dfb 2.7 5300 0.050 1800 eljpf3n3dfb 3.3 5000 0.070 1500 eljpf3n9dfb 3.9 4800 0.080 1400 eljpf4n7dfb 4.7 4600 0.100 1300 eljpf5n6dfb 5.6 4200 0.120 1200 eljpf6n8jfb 6.8 j : 5 % 4000 0.160 1100 eljpf8n2jfb 8.2 3700 0.210 900 eljpf10njfb 10 3200 0.260 750 recommended land pattern in mm (not to scale) dimensions in mm (not to scale) pf type 1005 (0402) ? 1 : self resonant frequency ? 2 : dc resistance standard packing quantity 10000 pcs./reel standard parts pe type 1608 (0603) recommended land pattern in mm (not to scale) dimensions in mm (not to scale) standard packing quantity 3000 pcs./reel standard parts (e12 series) part no. inductance q srf ? 1 (mhz) min. r dc ? 2 ( ) max. dc current (ma) max. (nh) tolerance (%) test freq. (m hz) min. test freq. (m hz) eljpe2n2kfa 2.2 k : 10 % 100 8 100 6000 0.030 2100 eljpe2n7kfa 2.7 8 5500 0.030 2100 eljpe3n3kfa 3.3 8 5500 0.040 2100 eljpe3n9kfa 3.9 9 5200 0.040 2100 eljpe4n7kfa 4.7 9 4800 0.050 2100 eljpe5n6kfa 5.6 9 4600 0.055 2100 eljpe6n8kfa 6.8 9 4000 0.055 1900 eljpe8n2kfa 8.2 9 3500 0.060 1700 ELJPE10NKFA 10 9 2800 0.065 1400 eljpe12nkfa 12 9 2500 0.080 1300 eljpe15nkfa 15 9 2200 0.100 900 eljpe18nkfa 18 9 2000 0.120 800 eljpe22nkfa 22 9 1800 0.150 700 ? 1 : self resonant frequency ? 2 : dc resistance nov. 2013 04 1 3
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fixed inductors (chip inductors) t 1 t 2 p 0 e f w a p 1 p 2 f d 1 f d 0 b tape running direction chip component t 2 t 1 part p 0 f w e fd 0 p 1 p 2 a tape running direction b e c d a b w taping reel dimensions in mm (not to scale) punched carrier tape dimensions in mm (not to scale) type f abwefp 1 rf, qf, pf 0.71 1.21 8.0 1.75 3.5 2.0 p 2 p 0 0 d 0 t 1 t 2 rf, qf, pf 2.0 4.0 0 1.5 0.7 max. 1.0 max. packaging methods (taping) type e abwefp 1 re, qe, pe 1.0 1.8 8.0 1.75 3.5 4.0 p 2 p 0 0 d 0 0 d 1 t 1 t 2 re, qe, pe 2.0 4.0 0 1.5 0 0.6 (0.27) 1.2 parts types abcdew rf, qf, pf re, qe, pe 180 60 13 21 2 9 quantity types quantity rf, qf, pf 10000 pcs. re, qe, pe 3000 pcs. standard packing quantity/reel ? under conditions of high temperature and humidity deterioration of the taping and packaging may be accelerated. please carefully control storage conditions and use the product within 6 months of receipt. embossed carrier tape dimensions in mm (not to scale) nov. 2013 04 1 4
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fixed inductors (chip inductors) t2 temperature (c) time t3 t2 t1 t1 0 soldering conditions refl ow soldering conditions pb free solder recommended temperature profi le flow soldering conditions preheat: 130 to 150 c, 60 to 180 s, soldering: 260 c, 5 s max. notes solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. even if storage conditions are within specified limits, solderability may be reduced with the passage of time. therefore, please control the storage conditions and try to use the product within 6 months of receipt. in case the product has been stored for a period longer than 6 months, use the product only after con? rmation of its solderability. type preheat soldering peak temperature time of re? ow t1 [c] t1 [s] t2 [c] t2 [s] t3 t3 limit f 150 to 180 60 to 120 230 c 40 max. 250 c, 10 s 260 c, 10 s 2 times max. e 150 to 180 60 to 120 230 c 40 max. 250 c, 10 s 260 c, 10 s 2 times max. nov. 2013 04 1 5
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fixed inductors (chip inductors) precautions for use 1. operation range and environments 1 these products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. av equipm ent, home electric ap pli anc es, office equipment, information and com mu ni ca tion equipment) 2 these products are not intended for use in the following special conditions. be fore using the products, care ful ly check the effects on their quality and performance, an d determine whether or not they can be used. ?in liquid, such as water, oil, chemicals, or organic solvent ?in direct sunlight, outdoors, or in dust ?in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 ?in an environment where these products cause dew condensation 2. handling 1 do not bring magnets or magnetized materials close to the product. the in uence of their magnetic eld can change the inductance value. 2 do not apply strong mechanical shocks by either dropping or collision with other parts. excessive schock can damage the part. 3. land pattern design 1 please refer to the recommended land pattern for each type shown on the datasheet. 2 avoid placing the chip inductor on any metal pattern ex cept the recommended land pattern because a drop of q and mutual conductance may occur. 3 in case of ow soldering, venting of soldering ux ga ses should be made for high density assemblies to get a good solder connection. 4 in case of re ow soldering, consider the layout becaus e taller components close to chip inductor tend to block thermal conduction. 4. mounting 1 in general, magnetic and electric characteristics of fe rrite cores can be changed by applying excessively strong force. placement force should not exceed 20 n. 2 do not bend or twist the pwb after mounting the part. 5. cleaning 1 do not use acid or alkali agents. some cleaning solvents may damage the part. con rm by testing the reliability in advance of mass production. 2 if ultrasonic cleaning is used, please con rm the reliability in advance. it is possible that combined resonance of component and pwb and cavitation can cause an abnormal vibration mode to exist causing damage. 6. caution about applying excessive current the rated current is de ned as the smaller value of ei ther the current value when the inductance drops 10 % down from the initial point or the cu rrent value when the average temperature of coil inside rises 20 c up from the initial point. do not operate pr oduct over the speci c max. current. safety precautions (common precautions for chip inductors) when using our products, no matter what sort of equipm ent they might be used for, be sure to make a written agreement on the specifications with us in advance. th e design and specifications in this catalog are subject to change without prior notice. ? do not use the products beyond the sp eci cations described in this catalog. this catalog explains the quality and performanc e of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of hu man life or other signi cant damage, such as damage to vehicles (au to mo bile, train, vessel), traffic lights, medi cal equipment, aerosp ace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. sep. 2012 01 1 6
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